Chen, Zhuo
Yang, Fan
Meguid, S.A.
This article is maintained by: Elsevier
Article Title: Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications
Journal Title: International Journal of Solids and Structures
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.ijsolstr.2014.06.030
Content Type: article
Copyright: Copyright © 2014 Elsevier Ltd. All rights reserved.