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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging

Crossref DOI link: https://doi.org/10.1016/j.jallcom.2017.12.355

Published Print: 2018-04

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Tian, Feifei https://orcid.org/0000-0001-6909-9959
Li, Cai-Fu

Zhou, Ming

Liu, Zhi-Quan https://orcid.org/0000-0001-7097-8977
Funding

Funding for this research was provided by:

National Key R&D Program of China (2017YFB0305700)

CAS (2015-ZD02)

Osaka University (J135104902)
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This article is maintained by: Elsevier

Article Title: The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging

Journal Title: Journal of Alloys and Compounds

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jallcom.2017.12.355

Content Type: article

Copyright: © 2017 Elsevier B.V. All rights reserved.