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Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix

Crossref DOI link: https://doi.org/10.1016/j.jmapro.2018.03.027

Published Print: 2018-04

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Bournias-Varotsis, Alkaios

Friel, Ross J.

Harris, Russell A.

Engstrøm, Daniel S.
Funding

Funding for this research was provided by:

Innovative electronics Manufacturing Research Centre

Engineering and Physical Sciences Research Council
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Text and Data Mining valid from 2018-04-01

Text and Data Mining valid from 2018-04-01

Version of Record valid from 2018-04-09
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This article is maintained by: Elsevier

Article Title: Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix

Journal Title: Journal of Manufacturing Processes

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jmapro.2018.03.027

Content Type: article

Copyright: Crown Copyright © 2018 Published by Elsevier Ltd on behalf of The Society of Manufacturing Engineers.