Li, Jianfeng https://orcid.org/0000-0001-5205-5167
Johnson, Christopher Mark
Buttay, Cyril
Sabbah, Wissam
Azzopardi, Stéphane
Funding for this research was provided by:
UK Engineering and Physical Science Research Council as part of the Innovative Electronic Manufacturing Research Centre (IeMRC) (EP/H03014X/1)
This article is maintained by: Elsevier
Article Title: Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
Journal Title: Journal of Materials Processing Technology
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jmatprotec.2014.08.002
Content Type: article
Copyright: Copyright © 2014 The Authors. Published by Elsevier B.V.