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Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations

Crossref DOI link: https://doi.org/10.1016/j.jmps.2016.04.021

Published Print: 2016-09

Update policy: https://doi.org/10.1016/elsevier_cm_policy

Authors

Yang, Xu-Sheng

Wang, Yun-Jiang

Zhai, Hui-Ru

Wang, Guo-Yong

Su, Yan-Jing

Dai, L.H.

Ogata, Shigenobu

Zhang, Tong-Yi
Funding

Funding for this research was provided by:

General Research Fund (622911)

National Basic Research Program of China (2012CB937502)

Science and Technology Commission of Shanghai Municipality (14DZ2261200)

NSFC (11132011)

NSFC (11402269)

NSFC (11472287)

National Key Basic Research Program of China (2012CB937500)

National Natural Science Foundation (51401083)
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This article is maintained by: Elsevier

Article Title: Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations

Journal Title: Journal of the Mechanics and Physics of Solids

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jmps.2016.04.021

Content Type: article

Copyright: © 2016 Elsevier Ltd. All rights reserved.