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Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate

Published Print: 2018-10

Authors

Sun, Fu-Long

Gao, Li-Yin

Liu, Zhi-Quan

Zhang, Hao

Sugahara, Tohru

Nagao, Shijo

Suganuma, Katsuaki
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Text and Data Mining valid from 2018-10-01

Text and Data Mining valid from 2018-10-01
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This article is maintained by: Elsevier

Article Title: Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate

Journal Title: Journal of Materials Science & Technology

CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jmst.2018.01.016

Content Type: article

Copyright: © 2018 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

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