Lyu, Ping https://orcid.org/0009-0006-6347-2920
Zhou, Bo https://orcid.org/0009-0004-2731-6432
Wu, Zhengyu
Sinha, Arkabrata
Xiang, Boyang
Luo, Dayou https://orcid.org/0000-0003-4760-0954
Şahin, Oğuzhan https://orcid.org/0000-0003-2104-5761
Liu, Wenbo
Funding for this research was provided by:
National Natural Science Foundation of China (52104122)
This article is maintained by: Elsevier
Article Title: Performance of 3D-printed UHPC optimized by particle packing model under standard and steam curing
Journal Title: Journal of Building Engineering
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.jobe.2026.115358
Content Type: article
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