Ortiz Gonzalez, J.
Aliyu, A.M.
Alatise, O.
Castellazzi, A.
Ran, L.
Mawby, P.
Funding for this research was provided by:
UK Engineering and Physical Science Research Council (EP/L007010/1, EP/K034804/1, EP/K035304/1)
This article is maintained by: Elsevier
Article Title: Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2016.07.062
Content Type: article
Copyright: © 2017 The Authors. Published by Elsevier Ltd.