Zhang, Shanshan
Yang, Huisheng
Gao, Kewei
Yan, Luchun
Pang, Xiaolu
Volinsky, Alex A.
Funding for this research was provided by:
National Key Research and Development Program of China (2016YFB0700201)
This article is maintained by: Elsevier
Article Title: Residual stress and warpage of AMB ceramic substrate studied by finite element simulations
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2019.04.025
Content Type: article
Copyright: © 2019 Elsevier Ltd. All rights reserved.