Lederer, M.
Kotas, A. Betzwar
Khatibi, G.
Funding for this research was provided by:
Christian Doppler Forschungsgesellschaft
This article is maintained by: Elsevier
Article Title: A lifetime assessment and prediction method for large area solder joints
Journal Title: Microelectronics Reliability
CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2020.113888
Content Type: article
Copyright: © 2020 The Authors. Published by Elsevier Ltd.