Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release
Crossref DOI link: https://doi.org/10.1038/s41598-020-66069-8
Published Online: 2020-06-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Chuantong
Suganuma, Katsuaki
Text and Data Mining valid from 2020-06-03
Version of Record valid from 2020-06-03
Article History
Received: 23 January 2020
Accepted: 12 May 2020
First Online: 3 June 2020
Competing interests
: The authors have no conflicts of interest to declare.
