Sun, Shuangxi
Mu, Wei
Edwards, Michael
Mencarelli, Davide
Pierantoni, Luca
Fu, Yifeng
Jeppson, Kjell
Liu, Johan
Journal title: Nanotechnology
Article type: paper
Article title: Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-05-02
Date accepted: 2016-06-20
Online publication date: 2016-07-08