Kusaka, Yasuyuki
Koutake, Masayoshi
Ushijima, Hirobumi
Funding for this research was provided by:
Japan Society for the Promotion of Science (Grant-in-Aid for Research Activity)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: High-resolution patterning of silver conductive lines by adhesion contrast planography
Copyright information: © 2015 IOP Publishing Ltd
Publication dates
Date received: 2015-04-01
Date accepted: 2015-06-12
Online publication date: 2015-08-06