Li, J
Wasley, T
Nguyen, T T
Ta, V D
Shephard, J D
Stringer, J
Smith, P
Esenturk, E
Connaughton, C
Kay, R
Funding for this research was provided by:
Engineering and Physical Sciences Research Council (EP/L016907/1, EP/L017431/1, EP/L017415/1, EP/L017350/1)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Hybrid additive manufacturing of 3D electronic systems
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-04-28
Date accepted: 2016-06-28
Online publication date: 2016-08-23