Nomura, Kazuya
Okada, Akiko
Shoji, Shuichi
Ogashiwa, Toshinori
Mizuno, Jun
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Application of I-structure though-glass interconnect filled with submicron gold particles to a hermetic sealing device
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-05-26
Date accepted: 2016-08-10
Online publication date: 2016-09-19