Joo, Sung-Jun
Park, Buhm
Kim, Do-Hyoung
Kwak, Dong-Ok
Park, Junhong
Kim, Hak-Sung
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2015-11-16
Date accepted: 2016-02-01
Online publication date: 2016-02-29