Gu, Jiebin
Liu, Bingjie
Chen, Gaoli
Li, Xinxin
Funding for this research was provided by:
Science and Technology Commission of Shanghai Municipality (14521106100)
National Natural Science Foundation of China (91323304)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-01-14
Date accepted: 2016-05-16
Online publication date: 2016-06-10