Reddy, Jayaprakash
Pratap, Rudra
Funding for this research was provided by:
National Program on Micro and Smart Systems (NPMA005)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-05-20
Date accepted: 2016-09-30
Online publication date: 2016-10-25