Zhang, Lemin
Jiao, Binbin
Ku, Will
Tseng, Li-Tien
Kong, Yanmei
Chien, Yu-Hao
Yun, Shichang
Chen, Dapeng
Funding for this research was provided by:
National High Technology Research and Development Program of China (863 Program) (No2015AA042602)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: An electrical test method for quality detecting of wafer level eutectic bonding
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2016-06-20
Date accepted: 2016-11-08
Online publication date: 2016-11-30