Zhang, Chaoqi
Yang, Hyung Suk
Bakir, Muhannad S
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects
Copyright information: © 2017 IOP Publishing Ltd
Publication dates
Date received: 2016-05-25
Date accepted: 2016-12-15
Online publication date: 2017-01-11