Swarnalatha, V
Narasimha Rao, A V
Ashok, A
Singh, S S
Pal, P
Funding for this research was provided by:
Department of Science and Technology and the Council of Scientific and Industrial Research, New Delhi, India (03(1320)/14/EMR-II, SR/S3/MERC/072/2011)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Modified TMAH based etchant for improved etching characteristics on Si{1 0 0} wafer
Copyright information: © 2017 IOP Publishing Ltd
Publication dates
Date received: 2017-01-22
Date accepted: 2017-05-30
Online publication date: 2017-06-27