Khan, Sharif https://orcid.org/0000-0002-7250-7359
Ordonez, Juan Sebastian
Stieglitz, Thomas https://orcid.org/0000-0002-7349-4254
Funding for this research was provided by:
BrinLinks-BrainTools Cluster of Excellence (EXC-1086)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Reliability of spring interconnects for high channel-count polyimide electrode arrays
Copyright information: © 2018 IOP Publishing Ltd
License information: cc-by Original content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Publication dates
Date received: 2017-12-15
Date accepted: 2018-02-14
Online publication date: 2018-03-08