Woetzel, S
Ihring, A https://orcid.org/0000-0003-4602-9135
Kessler, E
Franke, D
Dellith, J
Brown, A
Hänschke, F
Meyer, H-G
Schmidt, H
Frank, Th
Funding for this research was provided by:
Thueringer Aufbaubank (2011FE9001)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: Hermetic sealing of MEMS including lateral feedthroughs and room-temperature anodic bonding
Copyright information: © 2018 IOP Publishing Ltd
Publication dates
Date received: 2017-12-12
Date accepted: 2018-03-21
Online publication date: 2018-04-25