Liang, Hengmao https://orcid.org/0000-0003-4835-8776
Liu, Song
Xiong, Bin https://orcid.org/0000-0002-5480-9775
Funding for this research was provided by:
National Natural Science Foundation of China (51577186)
National Natural Science Foundation of China (51675516)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: 3D wafer level packaging technology based on the co-planar Au–Si bonding structure
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2018-10-24
Date accepted: 2019-01-02
Online publication date: 2019-01-25