Wang, Feng https://orcid.org/0000-0003-2244-9813
Wang, Fuliang https://orcid.org/0000-0003-1725-4827
Liu, Ximei
Funding for this research was provided by:
China Department of Science & Technology Program 973 (2015CB057202)
Article Title: The key role of suppressor diffusion in defect-free filling of the through-silicon-via with high depth
Journal Title: Journal of Micromechanics and Microengineering
Article Type: paper
Copyright Information: © 2019 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2018-11-12
Date Accepted: 2019-01-30
Online publication date: 2019-03-20