Klein, E https://orcid.org/0000-0003-2593-059X
Gossler, C
Paul, O https://orcid.org/0000-0002-2371-7448
Schwarz, U T
Ruther, P https://orcid.org/0000-0002-7358-003X
Funding for this research was provided by:
Seventh Framework Programme (600925)
Bundesministerium für Bildung und Forschung (13N13728)
Journal title: Journal of Micromechanics and Microengineering
Article type: paper
Article title: High-yield indium-based wafer bonding for large-area multi-pixel optoelectronic probes for neuroscientific research
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-03-29
Date accepted: 2019-06-17
Online publication date: 2019-07-08