Dalal, Neil
Gu, Yuan
Hines, Daniel R
Dasgupta, Abhijit
Das, Siddhartha https://orcid.org/0000-0002-1705-721X
Funding for this research was provided by:
NextFlex consortium
Journal title: Journal of Micromechanics and Microengineering
Article type: note
Article title: Cracks in the 3D-printed conductive traces of silver nanoparticle ink
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-02-12
Date accepted: 2019-07-03
Online publication date: 2019-07-25