Zhang, Yunfan https://orcid.org/0000-0003-3803-0996
Wu, Kangkang
Shen, Shengnan https://orcid.org/0000-0002-3964-8475
Zhang, Quanyong
Cao, Wan
Liu, Sheng https://orcid.org/0000-0001-6033-078X
Funding for this research was provided by:
the National Key R&D Program of China (2019YFB1704600)
the Hubei Provincial Natural Science Foundation of China (2020CFA032)
Article Title: Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors
Journal Title: Journal of Micromechanics and Microengineering
Article Type: paper
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Publication dates
Date Received: 2022-09-17
Date Accepted: 2022-12-06
Online publication date: 2022-12-30