Funding for this research was provided by:
National Natural Science Foundation of China (12472097)
Research Initiation Fund for Senior Talents of Jiangsu University (23JDG040)
Article Title: Deep silicon etching technology and applications: a review
Journal Title: Journal of Micromechanics and Microengineering
Article Type: paper
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Publication dates
Date Received: 2025-01-25
Date Accepted: 2025-08-05
Online publication date: 2025-08-22