Fogel, O https://orcid.org/0000-0002-1057-0184
Bernstein Toker, G
Cohen-Taguri, G https://orcid.org/0000-0003-3288-2848
Gergaud, P
Gaillard, F
Kotler, Z
Zalevsky, Z
Journal title: Journal of Physics D: Applied Physics
Article type: paper
Article title: An investigation of the influence of thermal process on the electrical conductivity of LIFT printed Cu structures
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-01-27
Date accepted: 2019-03-26
Online publication date: 2019-05-10