Wang, Jian https://orcid.org/0000-0001-8812-4398
Xing, Zexi https://orcid.org/0009-0002-1060-1283
Zhu, Jianzhao https://orcid.org/0009-0001-6413-0344
Li, Hongjian
Han, Zhiyun https://orcid.org/0000-0002-4366-5817
Ren, Hanwen https://orcid.org/0000-0002-8956-4413
Li, Qingmin https://orcid.org/0000-0001-5049-3980
Funding for this research was provided by:
Beijing Natural Science Foundation (L241043)
Fundamental Research Funds for the Central Universities (2023JC005)
National Natural Science Foundation of China (52217153)
Article Title: Adhesion-diffusion behavior and interfacial degradation mechanism of copper–aluminum under current-carrying friction conditions
Journal Title: Journal of Physics D: Applied Physics
Article Type: paper
Copyright Information: © 2025 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2025-01-15
Date Accepted: 2025-04-11
Online publication date: 2025-04-23