Chen, Tzu-Chia https://orcid.org/0000-0002-2942-7839
Article Title: Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor
Journal Title: Journal of Physics: Condensed Matter
Article Type: paper
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Publication dates
Date Received: 2023-02-17
Date Accepted: 2023-04-17
Online publication date: 2023-04-27