Drijarkara, Agustinus Praba
Gebrie, Tadesse Gergiso
Lee, Jae Yong
Kang, Chu-Shik https://orcid.org/0000-0002-4865-3276
Funding for this research was provided by:
Korea Research Institute of Standards and Science (GP2018-0001-02)
Journal title: Measurement Science and Technology
Article type: paper
Article title: Uncertainty evaluation of thickness and warp of a silicon wafer measured by a spectrally resolved interferometer
Copyright information: © 2018 IOP Publishing Ltd
Publication dates
Date received: 2018-01-02
Date accepted: 2018-03-27
Online publication date: 2018-05-09