Funding for this research was provided by:
the Natural Science Foundation of Guangdong Province, China (2016A030313454)
the Applied Science and Technology Research and Development Special Fund Project of Guangdong Province, China (2015B010133003)
the National Science and Technology Major Project of the Ministry of Science and Technology of China (2014ZX02503)
the National Natural Science Foundation of China (61573146)
Article Title: A novel solder joint diagnosis algorithm using differential geometry approach in high-density flexible integrated circuit substrates
Journal Title: Measurement Science and Technology
Article Type: paper
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Publication dates
Date Received: 2020-10-10
Date Accepted: 2021-01-27
Online publication date: 2021-05-06