Chiang, Kai-chieh http://orcid.org/0009-0008-3883-4517
Koslowski, Marisol http://orcid.org/0000-0001-9650-2168
Funding for this research was provided by:
Semiconductor Research Corporation
Article Title: Corrosion-induced fracture of Cu–Al microelectronics interconnects
Journal Title: Modelling and Simulation in Materials Science and Engineering
Article Type: paper
Copyright Information: © 2024 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2023-10-03
Date Accepted: 2024-03-14
Online publication date: 2024-03-25