Bera, K
Roy, Anushree https://orcid.org/0000-0001-8298-0302
Chugh, D https://orcid.org/0000-0003-0445-1629
Wong-Leung, J
Hoe Tan, H
Jagadish, C
Funding for this research was provided by:
Australian Research Council
Article Title: Role of defects and grain boundaries in the thermal response of wafer-scale hBN films
Journal Title: Nanotechnology
Article Type: paper
Copyright Information: © 2020 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-08-20
Date Accepted: 2020-10-19
Online publication date: 2020-11-24