Zheng, Zeyang
Huang, Yu-Ting
Wang, Zhenyu
Zhang, Mingyang
Wang, Wei-Ting
Chung, Chih-Chun
Cherng, Sheng-Jye
Tsai, Ya-Hui
Li, Po-Chien
Lu, Zhouguang
Chen, Chih-Ming
Feng, Shien-Ping https://orcid.org/0000-0002-3941-1363
Funding for this research was provided by:
General Research Fund of the Research Grants Council of Hong Kong Special Administrative Region, China (17206518)
Article Title: Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application
Journal Title: Nanotechnology
Article Type: paper
Copyright Information: © 2021 IOP Publishing Ltd
Publication dates
Date Received: 2020-11-30
Date Accepted: 2021-02-22
Online publication date: 2021-03-11