Liu, Boyu
Yu, Yongli
Hu, Zhennan
Li, Mengke https://orcid.org/0000-0002-5038-6015
Ma, Liuhong https://orcid.org/0000-0003-1612-668X
Sun, Haibin
Jia, Jianxin
Jiang, Changhui
Zhong, Yinghui https://orcid.org/0000-0001-9983-6729
Chen, Yuwei https://orcid.org/0000-0003-0148-3609
Duan, Zhiyong https://orcid.org/0000-0002-8059-3090
Funding for this research was provided by:
Ministry of Science and Technology of the People’s Republic of China (G2021026027L)
National Natural Science Foundation of China (U1704155)
Article Title: Ag metal interconnect wires formed by pseudoplastic nanoparticles fluid imprinting lithography with microwave assistant sintering
Journal Title: Nanotechnology
Article Type: paper
Copyright Information: © 2022 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2021-12-07
Date Accepted: 2022-03-17
Online publication date: 2022-04-20