Funding for this research was provided by:
National Natural Science Foundation of China (92373208)
Shenzhen Institutes of Advanced Technology Innovation Program for Excellent Young Researchers
Shenzhen Post-doctoral Funding
Basic and Applied Basic Research Foundation of Guangdong Province (2022A1515011485)
Article Title: Review of Cu–Cu direct bonding technology in advanced packaging
Journal Title: Nanotechnology
Article Type: paper
Copyright Information: © 2025 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2025-01-17
Date Accepted: 2025-06-02
Online publication date: 2025-06-23