Wang, Jianing https://orcid.org/0000-0003-3350-9180
An, Xia
Ren, Zhexuan https://orcid.org/0000-0001-7139-1297
Li, Gensong
Zhang, Wanrong
Huang, Ru
Funding for this research was provided by:
National Natural Science Foundation of China (No. 61421005)
111 Project (B18001)
Article Title: A novel body-on-insulator (BOI) FinFET with excellent TID tolerance and scaling capability
Journal Title: Semiconductor Science and Technology
Article Type: paper
Copyright Information: © 2019 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2019-06-23
Date Accepted: 2019-08-12
Online publication date: 2019-09-09