Liang, Hengmao https://orcid.org/0000-0003-4835-8776
Xiong, Bin https://orcid.org/0000-0002-5480-9775
Funding for this research was provided by:
National Natural Science Foundation of China (No.51577186)
Article Title: Modified Au/bulk Si eutectic bonding structure with reliable compatibility of KOH etching based on two-step local oxidation of silicon
Journal Title: Semiconductor Science and Technology
Article Type: paper
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Publication dates
Date Received: 2019-11-24
Date Accepted: 2020-02-13
Online publication date: 2020-04-03