Mu, Quanyi
Dunn, Conner K
Wang, Lei
Dunn, Martin L
Qi, H Jerry
Wang, Tiejun
Funding for this research was provided by:
National Science Foundation (1462894, 1462895)
Air Force Office of Scientific Research (15RT0885, FA9550-13-1-0088)
Journal title: Smart Materials and Structures
Article type: paper
Article title: Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines
Copyright information: © 2017 IOP Publishing Ltd
Publication dates
Date received: 2016-08-20
Date accepted: 2016-12-01
Online publication date: 2017-02-24