Funding for this research was provided by:
the NSFC-Guangdong Joint Fund Project of China (U1801259)
the Foshan Science and Technology Innovation Project of China (2018IT100242)
the Guangdong Basic and Applied Basic Research Foundation (2019A1515011243)
Article Title: Study on the rheological properties and polishing properties of SiO2@CI composite particle for sapphire wafer
Journal Title: Smart Materials and Structures
Article Type: paper
Copyright Information: © 2020 IOP Publishing Ltd
Publication dates
Date Received: 2020-03-07
Date Accepted: 2020-08-24
Online publication date: 2020-09-30