Zhu, Jianjian
Wen, Jinshan
Chen, Chunyang
Liu, Xiao https://orcid.org/0000-0003-4700-8643
Lan, Zifeng https://orcid.org/0000-0002-9265-468X
Wang, Yishou https://orcid.org/0000-0001-8043-843X
Qing, Xinlin https://orcid.org/0000-0002-9404-9715
Funding for this research was provided by:
National Natural Science Foundation of China (11972314)
Article Title: Curing monitoring of bonded composite patch at constant temperature with electromechanical impedance and system parameters evaluation approach
Journal Title: Smart Materials and Structures
Article Type: paper
Copyright Information: © 2021 IOP Publishing Ltd
Publication dates
Date Received: 2021-05-08
Date Accepted: 2021-11-24
Online publication date: 2021-12-08