Hassan, Rizwan Ul
Khalil, Shaheer Mohiuddin
Khan, Saeed Ahmed https://orcid.org/0000-0003-4163-0925
Ali, Shahzaib
Hussain, Hamza
Cho, Dae-Hyun https://orcid.org/0000-0002-6208-3142
Byun, Doyoung https://orcid.org/0000-0002-4315-4945
Funding for this research was provided by:
National Research Foundation of Korea (NRF-2017R1E1A1A01075353)
MOTIE, Korea (20009618)
Article Title: Experimental and numerical study of solder bumps impact on the underfill fluid flow under electrohydrodynamic effect
Journal Title: Physica Scripta
Article Type: paper
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Publication dates
Date Received: 2023-05-15
Date Accepted: 2023-09-28
Online publication date: 2023-10-11