Wang, Enze
Wang, Shunhua
Wang, Fu
Zhang, Guangan https://orcid.org/0000-0001-6046-6601
Shang, Lunlin https://orcid.org/0000-0001-9103-6567
Funding for this research was provided by:
Chinese Academy of Science and Technology Service Network Planning (No.20201600200092)
National Natural Science Foundation of China (No. 11905273)
Article Title: Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers
Journal Title: Physica Scripta
Article Type: paper
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Publication dates
Date Received: 2024-01-10
Date Accepted: 2024-05-16
Online publication date: 2024-06-06