Lamont, C https://orcid.org/0000-0002-7648-5185
Grego, T https://orcid.org/0000-0003-0693-6718
Nanbakhsh, K https://orcid.org/0000-0002-7718-4923
Shah Idil, A https://orcid.org/0000-0001-7686-3505
Giagka, V https://orcid.org/0000-0002-0822-2121
Vanhoestenberghe, A https://orcid.org/0000-0002-7244-5864
Cogan, S https://orcid.org/0000-0001-6316-3032
Donaldson, N https://orcid.org/0000-0001-8420-2512
Funding for this research was provided by:
Wellcome Trust (102037)
Electronic Components and Systems for European Leadership (Ecsel- 783132-Position-II-2017-IA)
Engineering and Physical Sciences Research Council (NS/A000026/1)
Article Title: Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: a comparative long-term ageing study
Journal Title: Journal of Neural Engineering
Article Type: paper
Copyright Information: © 2021 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2020-11-30
Date Accepted: 2021-03-22
Online publication date: 2021-04-06