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Corrigendum: Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers (2021 Surf. Topogr.: Metrol. Prop. 9 035001)

Crossref DOI link: https://doi.org/10.1088/2051-672X/ac39ac

Published Online: 2021-12-16

Published Print: 2021-12-01

Update policy: https://doi.org/10.1088/crossmark-policy

Authors

Liu, Haijun https://orcid.org/0000-0002-3587-2234
Zhou, Jing https://orcid.org/0000-0002-6239-678X
Han, Jiang

Tian, Xiaoqing

Chen, Shan

Lu, Lei https://orcid.org/0000-0001-8319-9382
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51805135)
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Article Title: Corrigendum: Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers (2021 Surf. Topogr.: Metrol. Prop. 9 035001)

Journal Title: Surface Topography: Metrology and Properties

Article Type: paper

Copyright Information: © 2021 IOP Publishing Ltd

Publication dates

Date Received: 2021-11-01

Date Accepted: 2021-11-15

Online publication date: 2021-12-16

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