Lee, Chee-Wei
Liang, Ying Shun
Ng, Doris Keh-Ting
Yang, Yi
Hnin, Yu Yu Ko
Wang, Qian
Funding for this research was provided by:
Data Storage Institute - A STAR (DSI/13-100001)
Journal title: Materials Research Express
Article type: paper
Article title: Study of ultrathin SiO2 Interlayer wafer bonding for heterogeneous III–V/Si photonic integration
Copyright information: © 2015 IOP Publishing Ltd
Publication dates
Date received: 2015-05-31
Date accepted: 2015-08-17
Online publication date: 2015-09-11