Wang, Hao
Zhang, Wei
Wang, Chengbin
Ma, Jiawen
Huai, Ping
Funding for this research was provided by:
Program of International S&T Cooperation (2014DFG60230)
Strategically Leading Program of the Chinese Academy of Sciences (XDA02040100)
Shanghai Municipal Science and Technology Commission (13ZR1448000)
National Natural Science Foundation of China (11505266)
Journal title: Materials Research Express
Article type: paper
Article title: Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod
Copyright information: © 2016 IOP Publishing Ltd
Publication dates
Date received: 2015-12-16
Date accepted: 2016-02-25
Online publication date: 2016-03-24